If rack-mounting, secure the chassis using standard industrial brackets.
Activating or cleaning surfaces prior to deposition. Pre-Cleaning: Removing native oxides. 2. Technical Specifications & Operating Parameters
Based on related Astron models (AX7680/AX7670) often detailed in similar manuals: : Typically achieves >95% dissociation of NF3cap N cap F sub 3 gas. Physical : Dimensions are roughly with a weight of approximately 38 kg (84 lbs). Gas Handling : Requires (Argon) for initial ignition; after ignition, NF3cap N cap F sub 3 can be added and Argon removed.
Commonly NF₃, O₂, N₂, H₂, or various fluorocarbons. Power: 180 to 228 VAC, 50/60 Hz, 3-phase. Cooling Water: Approximately 1.5 gpm, must be kept Ambient Temperature: Max 40°C. 3. Installation Guidelines
: Uses Low-Field Toroidal plasma technology to dissociate gases like NF3cap N cap F sub 3 mks astron 2l manual
—outside the process chamber. This protects your chamber internals from ion bombardment while providing a dense stream of neutral fluorine atoms for chemical etching. 2. Best Practices for Transport: Don't Lose Your Radicals
: The unit features internal thermal switches to prevent damage from overheating. Hazardous Byproducts cap N cap F sub 3 processes produce toxic byproducts like cap S i cap F sub 4 . Ensure effective vacuum scrubbers are in place. High Voltage
) dissociation to clean semiconductor process chambers. Operators looking for the require precise installation protocols, timing metrics, and electrical requirements to run and service models like the AX7651 and AX7657 safely.
While a standalone PDF specifically titled "Astron 2L User Manual" is not directly hosted on public generic search results, detailed operational guidance can be found in related series manuals and technical data sheets from MKS Instruments and authorized distributors like Core Operational Guide Ignition Sequence : Use 100% Argon ( ) for the initial ignition phase only. : Maintain an ignition pressure between 1 to 4 Torr (measured at the outlet). Process Transition Gas Handling : Requires (Argon) for initial ignition;
Verify cooling water flow rate and temperature.
[ \textPressure (Torr) = 10^\left(\fracV_\textout4 - 9\right) ] Where Vout is between 0 and 10 VDC.
The Astron 2L is a compact, remote plasma source that operates using RF (Radio Frequency) power to create a plasma outside the process chamber. This remote approach minimizes damage to sensitive chamber components compared to in-situ plasma.
Setting up the MKS Astron 2L correctly is crucial for its performance and longevity. While a complete manual is essential, here is an overview of the typical installation and operation process. Cooling Water: Approximately 1.5 gpm
Operating an industrial plasma source carries high risks. The manual splits safety guidelines into three critical categories: chemical, electrical, and mechanical. Chemical and Gas Hazards NF3cap N cap F sub 3 Toxicity : Nitrogen trifluoride ( NF3cap N cap F sub 3
| Feature | MKS Astron 2L | MKS Astron 2L Remote Plasma Source (RPS) | | :--- | :--- | :--- | | Primary Function | A linear, regulated DC power supply for benchtop and system integration. | A reactive gas generator for cleaning semiconductor process chambers. | | Typical Use | Powering electronic circuits, laboratory testing, and general R&D. | Cleaning CVD (Chemical Vapor Deposition) and etch chambers in semiconductor fabs. | | Key Specifications (Varies by model) | Typically dual-output (e.g., 0-32VDC, up to 500W). | Typically requires 208VAC 3-phase input, water-cooled. | | Common Model Numbers | ASTEX Astron 2L. | AX7687-85, AX7657-85. |
precursor gas to produce a high flux of neutral atomic fluorine radicals.
is a potent greenhouse gas and potentially hazardous. High dissociation rates (>94–95%) in the Astron unit help minimize environmental impact by converting it into reactive radicals that are easily scrubbed.