: It provides a standardized way to compare test results across different tool designs and manufacturers.
The 2020 update significantly modernized the standard to reflect current industry trends:
A successful press-in joint must balance two conflicting forces:
. The 2020 edition added requirements for documenting these with force-profile graphs. Board Specs
By ensuring your manufacturing processes map directly to the requirements in the IEC 60352-5 standard, you guarantee global compatibility, mechanical longevity, and electrical integrity for your electronic assemblies. iec 60352-5 pdf
The standard defines a press-in connection as a joint formed by inserting a pin into a plated-through hole (PTH) of a printed circuit board. The pin features a compliance zone that is structurally larger than the hole. When forced into the hole, the pin deforms elastically and plastically, creating a gas-tight, mechanically secure electrical connection. Scope of the Standard
If you are looking for the official “IEC 60352‑5 pdf”, make sure you are unless you are specifically maintaining legacy documentation.
It is part of the IEC 60352 series, which covers various solderless connection techniques (including crimping and IDC). Part 5 specifically focuses on the method of wrapping a solid wire around a terminal post with a sharp-cornered square or rectangular profile.
To obtain the official, complete, and legally compliant PDF, you must purchase it from authorized standards distributors. Here are the legitimate channels to acquire it: : It provides a standardized way to compare
Measures the force required to press the pin into the PCB. This helps manufacturers ensure that automation equipment is properly calibrated and that the board will not fracture during assembly.
Cycling assemblies between extreme low and high temperatures to simulate harsh operational environments.
The standard is primarily applicable to used in electrical and electronic equipment and their components. A press-in connection is formed by inserting a termination with a specific "press-in zone" into a hole on a printed circuit board (PCB) .
| Part | Title | Technology | Typical applications | |------|-------|------------|----------------------| | 60352-1 | Solderless connections – Part 1: Wrapped connections | Wire wrapping | Legacy telecom equipment, backplanes | | 60352-2 | Solderless connections – Part 2: Crimped connections | Crimping | Wire‑to‑terminal, automotive harnesses | | 60352-3 | Solderless connections – Part 3: Solderless accessible insulation displacement connections | Insulation displacement (IDC) | Ribbon cable connectors, flat‑flex circuits | | 60352-4 | Solderless connections – Part 4: Solderless non‑accessible insulation displacement connections | IDC (non‑accessible) | Mass‑termination connectors | | | Solderless connections – Part 5: Press‑in connections | Press‑fit | PCB‑to‑backplane, automotive electronics, power distribution | | 60352-6 | Solderless connections – Part 6: Insulation piercing connections | Insulation piercing | Field‑installable connectors | | 60352-7 | Solderless connections – Part 7: Spring clamp connections | Spring clamp | Terminal blocks, field wiring | Board Specs By ensuring your manufacturing processes map
Thickness of the copper sleeve within the hole (typically a minimum of 25 µm).
: Contains an informative Annex with assembly and board-design guidance, including hole tolerance ranges and material specifications.
Reality: IEC 60352-5 contains detailed test fixtures, tolerances, and validation tables. A summary does not qualify for ISO 9001 or IATF 16949 compliance audits.